Promoting the worldwide exchange of information about the uses or applications of thermal infrared sensing, imaging and measuring instruments through papers, workshops and short-courses.

About The ThermoSense Conference

ThermoSense is the largest and oldest international technical meeting focused on the scientific, industrial and general uses of infrared imaging and infrared temperature measurement. Its regular printed proceedings are found in most scientific and engineering libraries, providing an unequalled depth and breadth of technical information and reference data.

ThermoSense XXX is to be held the week of March 16, 2008, as part of the SPIE DSS Symposium at Orlando World Center Marriott Resort and Convention Center, Orlando Florida, USA.

Thermosense XXX

Conference 6939 - Proceedings of SPIE Volume 6939

Dates: Tuesday-Thursday 18 - 20 March 2008

Conference ChairsVladimir P. Vavilov, Tomsk Polytechnic Univ. (Russia); Douglas D. Burleigh, La Jolla Cove Consulting

Program Committee

Lee R. Allen, Allen Applied Infrared Technology, Emeritus Member; Nicolas P. Avdelidis, EBETAM S.A. (Greece); Pierre Bremond, Cedip Infrared Systems (France); Antonio Colantonio, Public Works and Government Services Canada (Canada); Fred P. Colbert, Colbert Infrared Services; K. Elliott Cramer, NASA Langley Research Ctr.; Ralph B. Dinwiddie, Oak Ridge National Lab.; Ermanno G. Grinzato, Consiglio Nazionale delle Ricerche (Italy); Sheng-Jen Hsieh, Texas Agricultural & Mechanical Univ.; Herbert Kaplan, Honeyhill Technical Co.; Timo T. Kauppinen, VTT (Finland); Dennis H. LeMieux, Siemens Corporate Research; Sven-Åke Ljungberg, Univ. of Gävle, Emeritus Member (Sweden); Robert P. Madding, FLIR Systems, Inc.; Xavier P. V. Maldague, Univ. Laval (Canada); G. Raymond Peacock, Temperatures.com, Inc.; Piotr Pregowski, Pregowski Infrared Services (Poland); Austin A. Richards, FLIR Systems; Andrés E. Rozlosnik, SI Termografía Infrarroja (Argentina); Morteza Safai, The Boeing Co.; Takahide Sakagami, Osaka Univ. (Japan); R. James Seffrin, Infraspection Institute; Steven M. Shepard, Thermal Wave Imaging, Inc.; John R. Snell, Jr., Snell Infrared; Gregory R. Stockton, Stockton Infrared Thermographic Services, Inc.; Lisa West Åkerblom, FLIR Systems AB (Sweden)
Monday 17 March

Vendor Presentations and Reception IV

Date: Monday 17 March

Time: 5:00 PM - 8:00 PM

Session Chairs: Andrés E. Rozlosnik, SI Termografía Infrarroja (Argentina); G. Raymond Peacock, Temperatures.com, Inc.

For the forth year, in conjunction with the Thermosense XXX conference, hardware and software vendors will give a brief presentation on what is new this year in their product lines that impact thermal imaging practices and applications. All presenting companies have a booth in the exhibition hall.



The intent of this workshop is to bring together Vendors and Early Arrival Thermosense and DSS exhibitors to highlight the newest products and services being shown at the Exhibition. In this way the busy technical conference attendees can better prioritize their activities when visiting the exhibits. It is also a relaxed opportunity for getting to know one another better and to have informal discussions on matters of mutual interest. A limited time for 10 to 15 minute vendor presentations starts the session, followed by a reception with snacks and soft drinks.


AVIO-Nippon Avionics Co., Ltd. (Booth 1417)

New IR Thermography Products from Nippon Avionics

Presenter: Yukinori Kimura, Manager, Partner Business Dept.


Cantronic Systems, Inc. (Booth 518)








Thermal Surveillance Relationship Between Target Distance and Pixels

Presenter: Jon Chynoweth, Executive Vice President


Cedip Infrared Systems (Booth 1317)

High-spatial Resolution Thermal Imaging Cameras and Portable Cameras for R&D Applications

Presenter: Pierre Bremond, Export Sales Manager, Industrial Applications and Thermography


Electrophysics Corp. (Booth 413)








640 X 480 Thermography Camera with Dual Laser Sighting

Presenter: Art Stout, Vice President, Business Development


FLIR Systems, Inc.-Commercial Vision Systems (Booth 603)

FLIR's Commercial Uncooled Cores: Automotive, Fire Fighting, and Military Applications

Presenter: Jay James, Vice President of Business Development for Cores and Components


Infrared Cameras Inc. (Texas Infrared) (Booth 1105)








ICI Prodigy and ICI Mirage: Medical, Aerospace, and Petrochemical Applications

Presenter: Gary Strahan, President


IRCAM GmbH (Booth 17)

New IR Cameras, Systems, and Software for IR Imaging and Thermography

Presenter: Monica Lopez Saenz, Managing Director and Co-Founder


Jenoptik-IR (Booth 1427)








Infrared Relay Lens for High-magnetic Environment Applications

Presenter: Ray Watts, Sales Manager


NEC Corp. (Booth 1417)

New Infrared Detector Module from NEC

Presenter: Hiroaki Ono, Assistant Manager


NEC San-ei Instruments, Ltd. (booth 1417)








Sensor Fusion Solution with TS9230/TS9260-New Fixed-mount Thermal Imaging Network Camera with Ruggedness and Reliability

Presenter: Tetsuo Tamura, Senior General Manager, Infrared Systems Dept.


Santa Barbara Infrared, Inc. (Booth 503)

Automated Testing of IR/EO Sensor Systems

Presenter: Alan Irwin, Senior Systems Engineer


SCD-SemiConductor Devices (Booth 903)








BIRD640 and SCD's Road Map for Uncooled Products

Presenter: Fabian Schapiro, Marketing Manager


Sensors Unlimited, Inc., (part of Goodrich Corp.) (Booth 717)

Extending InGaAs Wavelength Response: Advancements in InGaAs Technology and Applications

Presenter: Marc Hansen, Applications Engineer


StingRay Optics, LLC (Booth 1311)








Optics for NIR/SWIR Imaging

Presenter: Jennifer Myers, Sales and Marketing Manager


Surface Optics Corp. (Booth 907)

Field Emissivity Measurements Increase Accuracy of Temperature Predictions

Presenter: Brian Catanzaro, Consultant


Thermoteknix Systems Ltd. (Booth 1111)








Continued Advances in Miricle Increase Thermal Imaging Cameras from Thermoteknix

Presenter: Alistar Brown, Product Manager, Imaging


ThermoSense XXX- Vendor Presentations and Reception IV -- March 17, 2008

ThermoSense XXX

Vendor Presentations and Reception IV - Date: Monday 17 March

Time: 5:00 PM - 8:00 PM --Location: Crystal M --- Orlando World Center Marriott Resort and Convention Center

Orlando, FL USA- Session Chairs: Andrés E. Rozlosnik, SI Termografía Infrarroja (Argentina); G. Raymond Peacock, Temperatures.com, Inc.

ThermoSense 30 (XXX) - Advance Program - SPIE Conference 6939

Thermosense XXX

(Monday Evening -Thursday 18-20 March 2008 • (Proceedings of SPIE Vol. 6939)

Conference Chairs: Vladimir P. Vavilov, Tomsk Polytechnic Univ. (Russia); Douglas D. Burleigh, La Jolla Cove Consulting

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