CFP: Thermosense XXXII

Thermosense XXXII

Part of program track on IR Sensors and Systems at SPIE DSS – 5 to 9 April 2010 – Orlando World Center Marriott Resort and Convention Center – Orlando, FL United States

This conference has an open call for papers:

Conference Chairs

Ralph B. Dinwiddie, Oak Ridge National Lab.; Morteza Safai, The Boeing Co.

Program Committee

Andrea Acosta, Colbert Infrared Services; Nicolas P. Avdelidis, National Technical Univ. of Athens (Greece); Pierre G. Bremond, Cedip Infrared Systems (France); Jeff R. Brown, Hope College; Douglas Burleigh, La Jolla Cove Consulting; Antonio Colantonio, Public Works and Government Services Canada (Canada); Fred P. Colbert, Colbert Infrared Services; K. Elliott Cramer, NASA Langley Research Ctr.; Ermanno G. Grinzato, Consiglio Nazionale delle Ricerche (Italy); Sheng-Jen Hsieh, Texas A&M Univ.; Herbert Kaplan, Honeyhill Technical Co.; Timo T. Kauppinen, VTT (Finland); Kathryn M. Lee, United Space Alliance, LLC; Dennis H. LeMieux, Siemens Power Generation, Inc.; Robert P. Madding, FLIR Systems, Inc.; Xavier P. Maldague, Univ. Laval (Canada); Jonathan J. Miles, James Madison Univ.; Gary L. Orlove, FLIR Systems, Inc.; G. Raymond Peacock, Temperatures.com, Inc.; Piotr Pregowski, Pregowski Infrared Services (Poland); Andrés E. Rozlosnik, SI Termografía Infrarroja (Argentina); Takahide Sakagami, Osaka Univ. (Japan); R. James Seffrin, Infraspection Institute; Steven M. Shepard, Thermal Wave Imaging, Inc.; Gregory R. Stockton, Stockton Infrared Thermographic Services, Inc.; Vladimir P. Vavilov, Tomsk Polytechnic Univ. (Russian Federation); Lisa West Åkerblom, FLIR Systems AB (Sweden)

Steering Committee Emeritus Members: Sven-Åke Ljingberg, Univ. of Gäyle (Sweden); John R. Snell, Snell Inrared

Post-Meeting Proceedings Manuscript Due Date: 8 March 2010


ThermoSense Mission Statement

ThermoSense promotes the worldwide exchange of information about the uses or applications of thermal infrared sensing, imaging and measuring instruments through papers, workshops and short-courses. Over the past Thirty years these activities have included topics from the fundamentals of imaging and calibration to virtually all civilian applications of infrared equipment with special emphasis on problem solving and reduction to practice.

Thermal/infrared related papers are solicited in the areas listed and are also welcome in other areas:
Aerospace Applications

  • NDT & quality control (also see NDT)
  • corrosion/FOD/fatigue
  • aging aircraft
  • spacecraft & satellites Automotive Industry
  • manufacturing – process applications
  • predictive maintenance
  • process monitoring – automation
  • testing, measurement QA, R&R and validation.

Environmental and Resource Monitoring

  • agriculture & water conservation
  • fish & wildlife migration
  • geology
  • pollution & storm water outflow
  • remote detection & environmental sensing.

Food Processing and Agriculture

  • foreign object detection & characterization
  • process monitoring & automation
  • quality control
  • safety.

Infrastructure

  • utilities
  • airports & harbors
  • building surveys, historic studies
  • roads & bridges
  • thermal performance of buildings.

IR Image Fusion Applications

  • biological & medical
  • field/security
  • process
  • structural.

Manufacturing and Processing Industries

  • composites industry (also see NDT)
  • glass & ceramics
  • machine vision
  • metals processing
  • petroleum & chemical
  • plastics
  • predictive maintenance applications
  • pulp & paper
  • quality control applications
  • semiconductors & microelectronics.

Materials Evaluation and NDT

  • fatigue analysis
  • sonic IR
  • thermal properties of materials
  • thermal stress analysis (TSA).

Medical

  • calibration of IR thermometers
  • screening for human body temperature
  • veterinary applications of IR.

Miscellaneous

  • resource & maintenance management
  • economic impact, justifications studies
  • equipment, software, & practices guides
  • professionalism, standards, & certification.

NDT (Nondestructive Testing)

  • subsurface flaws
  • composite materials & structures
  • metallic structures
  • aerospace applications
  • civil structures (infrastructure)
  • underground anomalies
  • electronic components.

Power Generation and Distribution

  • field measurement issues
  • power plant heat-rate efficiency
  • predictive maintenance
  • safety & records.

Research and Development

  • animal applications
  • enhanced spatial resolution
  • enhanced time resolution
  • image interpretation
  • medical applications
  • microscopy
  • new methods
  • thermal modeling & FEA.

Security

  • disease screening
  • fire & rescue
  • law enforcement
  • surveillance in civilian applications.

In case of multiple submissions, the Program Committee reserves the right to allow only one oral presentation per author group while transferring the others to the poster session. During the Symposium, authors are expected to attend their respective sessions to enable interaction with the audience. Unless otherwise requested by authors, authors and abstracts will be posted at http://www.thermosense.org

Monday Evening Exhibitor Vendor Session

What’s New in Infrared Imaging Hardware and Software
(Presentations by equipment and service vendors)

This session is now in its sixth year and has become very popular. This venue provides an early opportunity for exhibitors to showcase their latest technology and products to the Thermosense and IR community prior to the opening of the exhibit. This enables the technical conference attendees can better prioritize their activities when visiting the exhibits. It is a casual meeting with ample time for questions and answers.

Your company must be an exhibitor at DSS10 to be part of this event. If you are interested in participating, or have more questions, please contact:

G. Raymond Peacock rpeacock@temperatures.com
or
Herbert Kaplan hkaplan@earthlink.net

Annual Infrared Imaging Gallery

Chairs: Jennifer L. Myers, StingRay Optics, LLC; Ralph B. Dinwiddie, Oak Ridge National Lab.

An open invitation to all participants in the 2010 SPIE DSS Conference and Exhibit to submit images demonstrating professional applications, artistic renditions, unique or creative depictions employing infrared cameras and lenses are welcome and encouraged. Submissions should include the photographers name, organization, contact information, Image Title and a brief description of the image highlighting the challenges behind the results. All images should be formatted to a maximum size of 20″ x 16″. Additional information on the viewing location as well as judging of the images will be available on http://www.thermosense.org

Student Poster and Poster Briefing Session

Chairs: Jonathan J. Miles, James Madison Univ. and Jeff R. Brown, Hope College

ThermoSense XXXI will again feature a Student Poster Session. The session is intended to promote awareness of, and encourage undergraduate and graduate research pertaining to, the ThermoSense conference. The oral sessions are open to students who wish to present their work as a manuscript for oral presentation. In order to take part in the Student Poster Session: (1) an abstract must be submitted electronically to SPIE via the web on or before the SPIE abstract due date of 21 September 2009 (a Tracking Number will be forwarded after submission); then (2) the abstract must be e-mailed to the session chair, Jonathan Miles, at milesjj@jmu.edu with the paper confirmation tracking number (i.e. DSS10-DS101-XX); (3) the lead author must be a student; and (4) the student author must commit to attending the symposium and presenting his or her poster.

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  1. 2010 Vendor Session | ThermoSense
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